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Volumn 13, Issue 2, 2004, Pages 0205-0211

Yield strengths and stress induced crackles in copper films: Effects of substrate and passivated layer

Author keywords

Copper film; Crackles; Microstructure; Yield strength

Indexed keywords

BENDING (DEFORMATION); CRACKS; DEPOSITION; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; NICKEL; PASSIVATION; STEEL; STRESS ANALYSIS; SUBSTRATES; THIN FILMS; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; YIELD STRESS;

EID: 9644257646     PISSN: 10091963     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (21)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.