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Volumn 13, Issue 2, 2004, Pages 0205-0211
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Yield strengths and stress induced crackles in copper films: Effects of substrate and passivated layer
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Author keywords
Copper film; Crackles; Microstructure; Yield strength
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Indexed keywords
BENDING (DEFORMATION);
CRACKS;
DEPOSITION;
GRAIN SIZE AND SHAPE;
MICROSTRUCTURE;
NICKEL;
PASSIVATION;
STEEL;
STRESS ANALYSIS;
SUBSTRATES;
THIN FILMS;
TITANIUM COMPOUNDS;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
YIELD STRESS;
COPPER FILMS;
CRACKLES;
HIGH-SPEED STEEL;
TI SUBSTRATES;
COPPER;
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EID: 9644257646
PISSN: 10091963
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (21)
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References (22)
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