Rapid silicon-to-steel bonding using inductive heating

American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS

Volumn , Issue , 2006, Pages

  Sosnowchik, Brian D ^a   Lin, Liwei ^a   Pisano, Albert P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FATIGUE TESTING; INDUCTION HEATING; MEMS; MICROSENSORS; SILICON; TENSILE TESTING;

BONDING STRENGTH; BONDING TEMPERATURE; SILICON BONDING;

STEEL;

EID: 85196494308     PISSN: 1096665X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Polanco, R., De Pablos, A., Miranzo, P. and Osendi, M. I., 2004, "Metal-Ceramic Interfaces: Joining Silicon Nitride-Stainless Steel", Applied Surface Science, 238 pp. 506-512.
2. Luo, C. and Lin, L., 2002, "The Application of Nanosecond-Pulsed Laser Welding Technology in MEMS Packaging With a Shadow Mask", Sensors and Actuators A, 97-98 pp. 398-404.
3. Cheng, Y. T., Lin, L. and Najafi, K., 2000, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging", Journal of Microelectromechanical Systems, 9 (1), pp. 3-8.
4. Lin, L., Cheng, Y. T. and Najafi, K., 1998, "Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method", Japanese Journal of Applied Physics, 37 pp. L1412-L1414.
5. Sosnowchik, B. D., Azevedo, R. G., Cao, A., Lin, L. and Pisano, A. P., 2005, "Silicon-to-Steel Bonding Using Rapid Thermal Annealing", IEEE Transactions on Advanced Packaging, 28 (4), pp. 626-634.
6. Rudnev, V., Loveless, D., Raymond, C. and Black, M., 2003. Handbook of Induction Heating, Marcel Dekker, Inc., New York.
7. Wojciechowski, K. E., Boser, B. E. and Pisano, A. P., 2004. "A MEMS Resonant Strain Sensor Operated in Air", 17th IEEE International Conference on Micro Electro Mechanical Systems, pp. 841-845.