Development and characterization of graphene enhanced thermal conductive adhesives

2016 6th Electronic System-Integration Technology Conference, ESTC 2016

Volumn , Issue , 2016, Pages

  Wang, Nan ^a   Logothetis, Nikolaos ^a,b   Wei, Mu ^a,c   Huang, Shirong ^c   Ye, Lilei ^b   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHT SMART HIGH TECH AB   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; FILLERS; GRAPHENE; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL;

ELECTRONIC COMPONENT; ELECTRONIC PACKAGING; FABRICATION PROCESS; GRAPHENE NANOSHEETS; HEAT DISSIPATION PROPERTIES; HIGH THERMAL CONDUCTIVITY; LIQUID EXFOLIATIONS; WORKING TEMPERATURES;

THERMAL CONDUCTIVITY;

EID: 85015020477     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2016.7764682     Document Type: Conference Paper

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