메뉴 건너뛰기




Volumn 86, Issue , 2014, Pages 276-283

Thermal conductivity enhancement of epoxy adhesive using graphene sheets as additives

Author keywords

Epoxy thermal conductive adhesive; Graphene sheets; Thermal conductivity

Indexed keywords

EPOXY RESINS; GRAPHENE; GRAPHITE;

EID: 84907062313     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2014.07.011     Document Type: Article
Times cited : (147)

References (55)
  • 4
    • 84870681030 scopus 로고    scopus 로고
    • Thermal analysis of the heat exchanger for power electronic device with higher power density
    • Y.C. Liang, J.N. Zhang, M. Li, Y.P. Guo, and J.S. Yuan Thermal analysis of the heat exchanger for power electronic device with higher power density Prz. Elektrotechniczn. 88 2012 328 332
    • (2012) Prz. Elektrotechniczn. , vol.88 , pp. 328-332
    • Liang, Y.C.1    Zhang, J.N.2    Li, M.3    Guo, Y.P.4    Yuan, J.S.5
  • 5
    • 1842524059 scopus 로고    scopus 로고
    • Integrated thermal management techniques for high power electronic devices
    • R.J. McGlen, R. Jachuck, and S. Lin Integrated thermal management techniques for high power electronic devices Appl. Therm. Eng. 24 2004 1143 1156
    • (2004) Appl. Therm. Eng. , vol.24 , pp. 1143-1156
    • McGlen, R.J.1    Jachuck, R.2    Lin, S.3
  • 6
    • 0020764982 scopus 로고
    • Thermal frontiers in the design and packaging of microelectronic equipment
    • A.B. Cohen, A.D. Kraus, and S.F. Davidson Thermal frontiers in the design and packaging of microelectronic equipment J. Mech. Eng. 105 1982 53 59
    • (1982) J. Mech. Eng. , vol.105 , pp. 53-59
    • Cohen, A.B.1    Kraus, A.D.2    Davidson, S.F.3
  • 7
    • 79551473222 scopus 로고    scopus 로고
    • Design-for-reliability implementation in microelectronics packaging development
    • Liyu Yang, Rui Niu, and J. Xie Design-for-reliability implementation in microelectronics packaging development Microelectron. Int. 28 2011 29 40
    • (2011) Microelectron. Int. , vol.28 , pp. 29-40
    • Yang, L.1    Niu, R.2    Xie, J.3
  • 8
    • 0033292686 scopus 로고    scopus 로고
    • Thermal design of high power semiconductor packages for aircraft systems
    • F. Sarvar, and D.C. Whalley Thermal design of high power semiconductor packages for aircraft systems J. Electron Manuf. 9 1999 269 274
    • (1999) J. Electron Manuf. , vol.9 , pp. 269-274
    • Sarvar, F.1    Whalley, D.C.2
  • 9
    • 0038481269 scopus 로고    scopus 로고
    • Evolution of cooling technology for electrical, electronic, and microelectronic equipment
    • A.E. Bergles Evolution of cooling technology for electrical, electronic, and microelectronic equipment IEEE Trans. Compon. Pack. Technol. 26 2003 6 15
    • (2003) IEEE Trans. Compon. Pack. Technol. , vol.26 , pp. 6-15
    • Bergles, A.E.1
  • 11
    • 0343237735 scopus 로고    scopus 로고
    • Thermal management of high power electronics with phase change cooling
    • DOI 10.1016/S0017-9310(99)00318-X, PII S001793109900318X
    • T.J. Lu Thermal management of high power electronics with phase change cooling Int. J. Heat Mass Transf. 43 2000 2245 2256 (Pubitemid 30247655)
    • (2000) International Journal of Heat and Mass Transfer , vol.43 , Issue.13 , pp. 2245-2256
    • Lu, T.J.1
  • 12
    • 54549096385 scopus 로고    scopus 로고
    • Review of electrically conductive adhesive technologies for electronic packaging
    • M.J. Yim, and K.W. Paik Review of electrically conductive adhesive technologies for electronic packaging Electron Mater. Lett. 2 2006 183 194
    • (2006) Electron Mater. Lett. , vol.2 , pp. 183-194
    • Yim, M.J.1    Paik, K.W.2
  • 13
    • 0002061903 scopus 로고    scopus 로고
    • Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
    • C.P. Wong, and R.S. Bollampally Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging IEEE Trans. Adv. Pack. 22 1999 55 59
    • (1999) IEEE Trans. Adv. Pack. , vol.22 , pp. 55-59
    • Wong, C.P.1    Bollampally, R.S.2
  • 14
    • 79960510187 scopus 로고    scopus 로고
    • A review of dielectric polymer composites with high thermal conductivity
    • X.Y. Huang, P.K. Jiang, and T. Tanaka A review of dielectric polymer composites with high thermal conductivity IEEE Electr. Insul. M. 27 2011 8 16
    • (2011) IEEE Electr. Insul. M. , vol.27 , pp. 8-16
    • Huang, X.Y.1    Jiang, P.K.2    Tanaka, T.3
  • 15
    • 56949084879 scopus 로고    scopus 로고
    • Graphite nanoplatelet pastes vs. Carbon black pastes as thermal interface materials
    • C. Lin, and D.D.L. Chung Graphite nanoplatelet pastes vs. carbon black pastes as thermal interface materials Carbon 47 2009 295 305
    • (2009) Carbon , vol.47 , pp. 295-305
    • Lin, C.1    Chung, D.D.L.2
  • 16
    • 79958267317 scopus 로고    scopus 로고
    • 3/epoxy terminated poly(dimethylsiloxane) composites
    • 3/epoxy terminated poly(dimethylsiloxane) composites Carbon 49 2011 3503 3511
    • (2011) Carbon , vol.49 , pp. 3503-3511
    • Im, H.1    Kim, J.2
  • 17
    • 84863110620 scopus 로고    scopus 로고
    • Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites
    • X.Y. Huang, T. Iizuka, P.K. Jiang, Y. Ohki, and T. Tanaka Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites J. Phys. Chem. C 116 2012 13629 13639
    • (2012) J. Phys. Chem. C , vol.116 , pp. 13629-13639
    • Huang, X.Y.1    Iizuka, T.2    Jiang, P.K.3    Ohki, Y.4    Tanaka, T.5
  • 18
    • 34247366804 scopus 로고    scopus 로고
    • Thermal conductivity of silicone rubber filled with ZnO
    • Q.H. Mu, S.Y. Feng, and G.Z. Diao Thermal conductivity of silicone rubber filled with ZnO Polym. Compos. 28 2007 125 130
    • (2007) Polym. Compos. , vol.28 , pp. 125-130
    • Mu, Q.H.1    Feng, S.Y.2    Diao, G.Z.3
  • 19
    • 36348941682 scopus 로고    scopus 로고
    • Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing
    • DOI 10.1002/app.27027
    • K.C. Yung, and H. Liem Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing J. Appl. Polym. Sci. 106 2007 3587 3591 (Pubitemid 350149313)
    • (2007) Journal of Applied Polymer Science , vol.106 , Issue.6 , pp. 3587-3591
    • Yung, K.C.1    Liem, H.2
  • 21
    • 82655177024 scopus 로고    scopus 로고
    • Characterization of a hybrid Cu paste as an isotropic conductive adhesive
    • Y.S. Eom, K.S. Choi, S.H. Moon, J.H. Park, J.H. Lee, and J.T. Moon Characterization of a hybrid Cu paste as an isotropic conductive adhesive ETRI J. 33 2011 864 870
    • (2011) ETRI J. , vol.33 , pp. 864-870
    • Eom, Y.S.1    Choi, K.S.2    Moon, S.H.3    Park, J.H.4    Lee, J.H.5    Moon, J.T.6
  • 23
    • 79953773320 scopus 로고    scopus 로고
    • Effect of coupling agents on the thermal conductivity of aluminum particle/epoxy resin composites
    • W.Y. Zhou Effect of coupling agents on the thermal conductivity of aluminum particle/epoxy resin composites J. Mater. Sci. 46 2011 3883 3889
    • (2011) J. Mater. Sci. , vol.46 , pp. 3883-3889
    • Zhou, W.Y.1
  • 24
    • 77954087951 scopus 로고    scopus 로고
    • Thermal conductivity enhancement of Ag nanowires on an organic phase change material
    • J.L. Zeng, Z. Cao, D.W. Yang, L.X. Sun, and L. Zhang Thermal conductivity enhancement of Ag nanowires on an organic phase change material J. Therm. Anal. Calorim. 101 2010 385 389
    • (2010) J. Therm. Anal. Calorim. , vol.101 , pp. 385-389
    • Zeng, J.L.1    Cao, Z.2    Yang, D.W.3    Sun, L.X.4    Zhang, L.5
  • 25
    • 84855319432 scopus 로고    scopus 로고
    • Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material
    • H. Yu, L.L. Li, T. Kido, G.N. Xi, G.C. Xu, and F. Guo Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material J. Appl. Polym. Sci. 124 2012 669 677
    • (2012) J. Appl. Polym. Sci. , vol.124 , pp. 669-677
    • Yu, H.1    Li, L.L.2    Kido, T.3    Xi, G.N.4    Xu, G.C.5    Guo, F.6
  • 26
    • 84862928239 scopus 로고    scopus 로고
    • The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles
    • S. Choi, H. Im, and J. Kim The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles Nanotechnology 23 2012 5303 5312
    • (2012) Nanotechnology , vol.23 , pp. 5303-5312
    • Choi, S.1    Im, H.2    Kim, J.3
  • 27
    • 24144499437 scopus 로고    scopus 로고
    • Comparative study of thermally conductive fillers in underfill for the electronic components
    • DOI 10.1016/j.diamond.2005.05.008, PII S0925963505002013
    • W.S. Lee, and J. Yu Comparative study of thermally conductive fillers in underfill for the electronic components Diam. Relat. Mater. 14 2005 1647 1653 (Pubitemid 41229964)
    • (2005) Diamond and Related Materials , vol.14 , Issue.10 , pp. 1647-1653
    • Lee, W.S.1    Yu, J.2
  • 28
    • 58049142576 scopus 로고    scopus 로고
    • Enhanced thermal conductivity in a hybrid graphite nanoplatelet - Carbon nanotube filler for epoxy composites
    • A.P. Yu, P. Ramesh, X.B. Sun, E. Bekyarova, M.E. Itkis, and R.C. Haddon Enhanced thermal conductivity in a hybrid graphite nanoplatelet - carbon nanotube filler for epoxy composites Adv. Mater. 20 2008 4740 4744
    • (2008) Adv. Mater. , vol.20 , pp. 4740-4744
    • Yu, A.P.1    Ramesh, P.2    Sun, X.B.3    Bekyarova, E.4    Itkis, M.E.5    Haddon, R.C.6
  • 29
    • 70349680919 scopus 로고    scopus 로고
    • An electrical method for the measurement of the thermal and electrical conductivity of reduced graphene oxide nanostructures
    • T. Schwamb, B.R. Burg, N.C. Schirmer, and D. Poulikakos An electrical method for the measurement of the thermal and electrical conductivity of reduced graphene oxide nanostructures Nanotechnology 20 2009 5704 5709
    • (2009) Nanotechnology , vol.20 , pp. 5704-5709
    • Schwamb, T.1    Burg, B.R.2    Schirmer, N.C.3    Poulikakos, D.4
  • 31
    • 47749150628 scopus 로고    scopus 로고
    • Measurement of the elastic properties and intrinsic strength of monolayer graphene
    • DOI 10.1126/science.1157996
    • C. Lee, X.D. Wei, J.W. Kysar, and J. Hone Measurement of the elastic properties and intrinsic strength of monolayer graphene Science 321 2008 385 388 (Pubitemid 352029970)
    • (2008) Science , vol.321 , Issue.5887 , pp. 385-388
    • Lee, C.1    Wei, X.2    Kysar, J.W.3    Hone, J.4
  • 34
    • 84873396037 scopus 로고    scopus 로고
    • Enhanced thermal conductivity of epoxy-graphene composites by using non-oxidized graphene flakes with non-covalent functionalization
    • S.H. Song, K.H. Park, B.H. Kim, Y.W. Choi, G.H. Jun, D.J. Lee, B.S. Kong, K.W. Paik, and S. Jeon Enhanced thermal conductivity of epoxy-graphene composites by using non-oxidized graphene flakes with non-covalent functionalization Adv. Mater. 25 2013 732 737
    • (2013) Adv. Mater. , vol.25 , pp. 732-737
    • Song, S.H.1    Park, K.H.2    Kim, B.H.3    Choi, Y.W.4    Jun, G.H.5    Lee, D.J.6    Kong, B.S.7    Paik, K.W.8    Jeon, S.9
  • 35
    • 84255168521 scopus 로고    scopus 로고
    • Enhanced convective heat transfer using graphene dispersed nanofluids
    • T.T. Baby, and S. Ramaprabhu Enhanced convective heat transfer using graphene dispersed nanofluids Nanoscale Res. Lett. 6 2011 289 298
    • (2011) Nanoscale Res. Lett. , vol.6 , pp. 289-298
    • Baby, T.T.1    Ramaprabhu, S.2
  • 38
    • 84856953903 scopus 로고    scopus 로고
    • Graphene-multilayer graphene nanocomposites as highly efficient thermal interface materials
    • K.M.F. Shahil, and A.A. Balandin Graphene-multilayer graphene nanocomposites as highly efficient thermal interface materials Nano Lett. 12 2012 861 867
    • (2012) Nano Lett. , vol.12 , pp. 861-867
    • Shahil, K.M.F.1    Balandin, A.A.2
  • 39
    • 84868673862 scopus 로고    scopus 로고
    • Toward effective synergetic effects from graphene nanoplatelets and carbon nanotubes on thermal conductivity of ultrahigh volume fraction nanocarbon epoxy composites
    • X.Y. Huang, C.Y. Zhi, and P.K. Jiang Toward effective synergetic effects from graphene nanoplatelets and carbon nanotubes on thermal conductivity of ultrahigh volume fraction nanocarbon epoxy composites J. Phys. Chem. C 116 2012 23812 23820
    • (2012) J. Phys. Chem. C , vol.116 , pp. 23812-23820
    • Huang, X.Y.1    Zhi, C.Y.2    Jiang, P.K.3
  • 40
    • 84892381923 scopus 로고    scopus 로고
    • Production of monolayer, trilayer, and multi-layer graphene sheets by a re-expansion and exfoliation method
    • Y.X. Fu, X.M. Wang, D.C. Mo, and S.S. Lu Production of monolayer, trilayer, and multi-layer graphene sheets by a re-expansion and exfoliation method J. Mater. Sci. 49 2014 2315 2323
    • (2014) J. Mater. Sci. , vol.49 , pp. 2315-2323
    • Fu, Y.X.1    Wang, X.M.2    Mo, D.C.3    Lu, S.S.4
  • 41
    • 84868136622 scopus 로고    scopus 로고
    • One-pot electrochemical synthesis of graphene by the exfoliation of graphite powder in sodium dodecyl sulfate and its decoration with platinum nanoparticles for methanol oxidation
    • K. Kakaei One-pot electrochemical synthesis of graphene by the exfoliation of graphite powder in sodium dodecyl sulfate and its decoration with platinum nanoparticles for methanol oxidation Carbon 51 2013 195 201
    • (2013) Carbon , vol.51 , pp. 195-201
    • Kakaei, K.1
  • 42
    • 79955394936 scopus 로고    scopus 로고
    • Top down method for synthesis of highly conducting graphene by exfoliation of graphite oxide using focused solar radiation
    • V. Eswaraiah, S.S.J. Aravind, and S. Ramaprabhu Top down method for synthesis of highly conducting graphene by exfoliation of graphite oxide using focused solar radiation J. Mater. Chem. 21 2011 6800 6803
    • (2011) J. Mater. Chem. , vol.21 , pp. 6800-6803
    • Eswaraiah, V.1    Aravind, S.S.J.2    Ramaprabhu, S.3
  • 44
    • 84876373110 scopus 로고    scopus 로고
    • Raman spectroscopy as a versatile tool for studying the properties of graphene
    • A.C. Ferrari, and D.M. Basko Raman spectroscopy as a versatile tool for studying the properties of graphene Nat. Nanotechnol. 8 2013 235 246
    • (2013) Nat. Nanotechnol. , vol.8 , pp. 235-246
    • Ferrari, A.C.1    Basko, D.M.2
  • 45
    • 79952951889 scopus 로고    scopus 로고
    • Chirality and thickness-dependent thermal conductivity of few-layer graphene: A molecular dynamics study
    • W.R. Zhong, M.P. Zhang, B.Q. Ai, and D.Q. Zheng Chirality and thickness-dependent thermal conductivity of few-layer graphene: a molecular dynamics study Appl. Phys. Lett. 98 2011 3107 3110
    • (2011) Appl. Phys. Lett. , vol.98 , pp. 3107-3110
    • Zhong, W.R.1    Zhang, M.P.2    Ai, B.Q.3    Zheng, D.Q.4
  • 48
    • 84954824794 scopus 로고
    • Berechnung verschiedener physikalischer Konstanten von heterogenen Substanzen. I. Dielektrizitätskonstanten und Leitfähigkeiten der Mischkörper aus isotropen Substanzen
    • V.D.A.G. Bruggeman Berechnung verschiedener physikalischer Konstanten von heterogenen Substanzen. I. Dielektrizitätskonstanten und Leitfähigkeiten der Mischkörper aus isotropen Substanzen Ann. Phys. 416 1935 636 663
    • (1935) Ann. Phys. , vol.416 , pp. 636-663
    • Bruggeman, V.D.A.G.1
  • 49
    • 0022061332 scopus 로고
    • Thermal conductivity of polymer filled with carbon materials: Effect of conductive particle chains on thermal conductivity
    • DOI 10.1002/app.1985.070300534
    • Y. Agar, and T. Uno Thermal conductivity of polymer filled with carbon materials: effect of conductive particle chains on thermal conductivity J. Appl. Polym. Sci. 30 1985 2225 2235 (Pubitemid 15490290)
    • (1985) Journal of Applied Polymer Science , vol.30 , Issue.5 , pp. 2225-2235
    • Agari, Y.1    Uno, T.2
  • 50
    • 33745311981 scopus 로고
    • Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials
    • S.E. Gustafsson Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials Rev. Sci. Instrum. 62 1991 797 804
    • (1991) Rev. Sci. Instrum. , vol.62 , pp. 797-804
    • Gustafsson, S.E.1
  • 51
    • 36448999424 scopus 로고
    • Thermal conductivity,thermal diffusivity and specific heat of thin samples from transient measurements with hot disk sensors
    • M. Gustavsson, E. Karawacki, and S.E. Gustafsson Thermal conductivity,thermal diffusivity and specific heat of thin samples from transient measurements with hot disk sensors Rev. Sci. Instrum. 65 1994 3856 3859
    • (1994) Rev. Sci. Instrum. , vol.65 , pp. 3856-3859
    • Gustavsson, M.1    Karawacki, E.2    Gustafsson, S.E.3
  • 52
    • 46449100294 scopus 로고    scopus 로고
    • Materials science-Graphene-based materials
    • D. Li, and R.B. Kaner Materials science-Graphene-based materials Science 320 2008 1170 1171
    • (2008) Science , vol.320 , pp. 1170-1171
    • Li, D.1    Kaner, R.B.2
  • 53
    • 34250350449 scopus 로고    scopus 로고
    • Graphite nanoplatelet-epoxy composite thermal interface materials
    • DOI 10.1021/jp071761s
    • A.P. Yu, P. Ramesh, M.E. Itkis, E. Bekyarova, and R.C. Haddon Graphite nanoplatelet-epoxy composite thermal interface materials J. Phys. Chem. C 111 2007 7565 7569 (Pubitemid 46918242)
    • (2007) Journal of Physical Chemistry C , vol.111 , Issue.21 , pp. 7565-7569
    • Yu, A.1    Ramesh, P.2    Itkis, M.E.3    Bekyarova, E.4    Haddon, R.C.5
  • 54
    • 0023421463 scopus 로고
    • Thermal conductivity of a polymer composite filled with mixtures of particles
    • DOI 10.1002/app.1987.070340408
    • Y. Agari, M. Tanaka, and S. Nagai Thermal conductivity of a polymer composite filled with mixtures of particles J. Appl. Polym. Sci. 34 1987 1429 1437 (Pubitemid 17658748)
    • (1987) Journal of Applied Polymer Science , vol.34 , Issue.4 , pp. 1429-1437
    • Agari, Y.1    Tanaka, M.2    Nagai, S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.