Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

Composites Part A: Applied Science and Manufacturing

Volumn 94, Issue , 2017, Pages 209-216

  Gu, Junwei ^a   Lv, Zhaoyuan ^a   Wu, Yalan ^b   Guo, Yongqiang ^a   Tian, Lidong ^a   Qiu, Hua ^a   Li, Wanzheng ^a   Zhang, Qiuyu ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b 323 Hospital of PLA   (China)

Author keywords

A. Polymer matrix composites (PMCs); B. Thermal properties; C. Electrospinning; D. Compression moulding

Indexed keywords

BORON NITRIDE; DIELECTRIC LOSSES; ELECTROSPINNING; GLASS TRANSITION; HEAT RESISTANCE; MICROELECTRONICS; NITRIDES; POLYMERIZATION; PRESSES (MACHINE TOOLS); SPINNING (FIBERS); THERMODYNAMIC STABILITY;

DIELECTRIC LOSS TANGENT; ELECTROSPUN FIBERS; HEAT RESISTANCE INDICES; HOT-PRESS METHOD; IN-SITU POLYMERIZATION; MICRO-ELECTRONIC DEVICES; POLYMER MATRIX COMPOSITES (PMCS); THERMAL IMIDIZATION;

POLYMER MATRIX COMPOSITES;

EID: 85007304599     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2016.12.014     Document Type: Article

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