Excellent thermal conductivity and dielectric properties of polyimide composites filled with silica coated self-passivated aluminum fibers and nanoparticles

Applied Physics Letters

Volumn 102, Issue 25, 2013, Pages

  Zhou, Yongcun ^a,b   Bai, Yuanyuan ^a   Yu, Ke ^a   Kang, Yan ^a   Wang, Hong ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NANOPARTICLES; COMPOSITE PROPERTIES; ELECTRONIC PACKAGING; HIGH THERMAL CONDUCTIVITY; MULTILAYER COATING STRUCTURES; POLYIMIDE COMPOSITES; POLYMER BASED COMPOSITE; RELATIVE PERMITTIVITY;

ALUMINUM; DIELECTRIC LOSSES; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRONICS PACKAGING; FILLERS; NANOPARTICLES; PERMITTIVITY; POLYIMIDES; POLYMER MATRIX COMPOSITES; SILICA; THERMAL CONDUCTIVITY OF SOLIDS;

ALUMINUM COATINGS;

EID: 84879865219     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4812653     Document Type: Article

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