Enhanced thermal conductivity of SiCp/PS composites by electrospinning-hot press technique

Composites Part A: Applied Science and Manufacturing

Volumn 79, Issue , 2015, Pages 8-13

  Gu, Junwei ^a   Lv, Zhaoyuan ^a   Wu, Yalan ^b   Zhao, Ruoxi ^a   Tian, Lidong ^a   Zhang, Qiuyu ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b The 323 Hospital of PLA   (China)

Author keywords

A. Polymer matrix composites (PMCs); B. Thermal properties; E. Compression moulding

Indexed keywords

ELECTROSPINNING; LAMINATING; PERMITTIVITY; POLYMER MATRIX COMPOSITES; PRESSES (MACHINE TOOLS); SILICON CARBIDE; SPINNING (FIBERS); THERMODYNAMIC PROPERTIES;

DIELECTRIC CONSTANT VALUES; E. COMPRESSION MOULDINGS; ELECTROSPUN MATS; ENHANCED THERMAL CONDUCTIVITY; HOT-PRESS TECHNIQUES; MASS FRACTION; POLYMER MATRIX COMPOSITES (PMCS); SILICON CARBIDE PARTICLES;

THERMAL CONDUCTIVITY;

EID: 84942102084     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2015.09.005     Document Type: Article

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