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Volumn 6, Issue 22, 2016, Pages 18279-18287

Preparation and properties of thermally conductive polyimide/boron nitride composites

(9) Yang, Na a Xu, Chen a Hou, Jun a Yao, Yanmei a Zhang, Qingxin a Grami, Maryam E b He, Lianqi c Wang, Nongyue a Qu, Xiongwei a

a HEBEI UNIVERSITY OF TECHNOLOGY (China)

b WINONA STATE UNIVERSITY (United States)

c Ouya Hose Corporation (China)

Author keywords

[No Author keywords available]

Indexed keywords

BORON NITRIDE; COUPLING AGENTS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; GRAVIMETRIC ANALYSIS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; III-V SEMICONDUCTORS; MICROELECTRONICS; NITRIDES; POLYIMIDES; THERMAL INSULATION; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

CONDUCTIVE POLYIMIDES; ENHANCED THERMAL CONDUCTIVITY; FOURIER TRANSFORM INFRARED; HEXAGONAL BORON NITRIDE (H-BN); IN-SITU POLYMERIZATION; MICROELECTRONIC INDUSTRY; SILANE COUPLING AGENT; SUBSTRATE MATERIAL;

THERMAL CONDUCTIVITY;

EID: 84958794331 PISSN: None EISSN: 20462069 Source Type: Journal
DOI: 10.1039/c6ra01084a Document Type: Article

Times cited : (155)

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