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Volumn 40, Issue 8-10, 2000, Pages 1653-1658

A modelling approach to assess the creep behaviour of large-area solder joints

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0000261134     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00184-0     Document Type: Article
Times cited : (13)

References (5)
  • 2
    • 0032669974 scopus 로고    scopus 로고
    • Reliability in large area solder joint assemblies and effects of thermal expansion mismatch and die size
    • Jun He, Morris WL, Shaw MC, Sridhar N, Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size, Advancing Microelectronics (1999) 39-46
    • (1999) Advancing Microelectronics , pp. 39-46
    • He, J.1    Morris, W.L.2    Shaw, M.C.3    Sridhar, N.4
  • 3
  • 5
    • 0040623692 scopus 로고
    • ITRI (International Tin Research Institute), Publication No. 656
    • Solder Alloy Data, ITRI (International Tin Research Institute), Publication No. 656, 1986
    • (1986) Solder Alloy Data


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.