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Volumn 40, Issue 8-10, 2000, Pages 1653-1658
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A modelling approach to assess the creep behaviour of large-area solder joints
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0000261134
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-2714(00)00184-0 Document Type: Article |
Times cited : (13)
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References (5)
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