A modelling approach to assess the creep behaviour of large-area solder joints

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1653-1658

  Poech, M H ^a   Eisele, R ^b  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b DANFOSS A S   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000261134     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00184-0     Document Type: Article

References (5)

1. Lau J, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, 1993
2. Jun He, Morris WL, Shaw MC, Sridhar N, Reliability in Large Area Solder Joint Assemblies and Effects of Thermal Expansion Mismatch and Die Size, Advancing Microelectronics (1999) 39-46
3. Herr E, Frey T, Schlegel R, Stuck A, Zehringer R, Substrate-to-Base Solder Joint Reliability in High Power IGET Modules, Microelectronics Reliability 37 (1997) No. 10/11, 1719-1722
4. Winter PR, Wallach ER, Microstructural Modelling and Electronic Interconnect Reliability; Soldering and Surface Mount Technology 26 (1997) 61-64
5. Solder Alloy Data, ITRI (International Tin Research Institute), Publication No. 656, 1986