Reliability testing of high-power multi-chip IGBT modules

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1659-1663

  Lefranc, G ^a   Licht, T ^b   Schultz, H J ^a   Beinert, R ^b   Mitic, G ^a  

^a SIEMENS AG   (Germany)

^b Eupec GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042011155     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00185-2     Document Type: Article

References (9)

1. Hierholzer, M., "Application of high-power IGBT modules", Proc. PCIM 96, 1996, 26.
2. Hamidi, A. et al., "Reliability of high-power IGBT modules: reliability testing", Proc. EPE 97, Trondheim
3. Berg, H., Wolfgang, E., "Advanced IGBT modules for railway traction applications: Testing for thermal fatigue effects due to traction cycles", Proc. ESREF 98, Copenhagen
4. Mitic, G. et al., "Reliability of AlN substrates and their solder joints in IGBT power modules", IEEE-Electron Device Society, Proc. ESREF 99, 1159-1164 (1999)
5. Sommer, K. H. et al., "Multi-chip high-power IGBT modules for traction and industrial application", Proc. EPE97, Trondheim
6. Brite EuRam BE 95-2105 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications
7. Coquery et al., "Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high-power IGBT modules", Proc. EPE 99, Lausanne
8. Herr, E. et al., "Substrate to base solder joint reliability in high-power IGBT modules", Microelectron. Reliab. Vol. 37, 1997 (1719)
9. Lefranc, G. et al "AlSiC improves reliability of IGBT power modules", Int. conference composite materials, Proc. ICCM 12, Paris, 1999