Micro-Scale Solder Joints between Cu-Cu Wires Formed by Nanoparticle Enabled Lead-Free Solder Pastes

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 1203-1208

  Wernicki, Evan ^a   Fratto, Edward ^a   Shu, Yang ^a   Gao, Fan ^a   Gu, Zhiyong ^a  

^a University of Massachusetts   (United States)

Author keywords

Cu Cu joining; Electrical measurement; Lead free; Low temperature; Nanosolder; Reflow

Indexed keywords

COPPER; ELECTRIC VARIABLES MEASUREMENT; ELECTRON MICROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOPARTICLES; NETWORK COMPONENTS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING; SYNTHESIS (CHEMICAL); TEMPERATURE; TIN; TRANSMISSION ELECTRON MICROSCOPY; WIRE;

ELECTRICAL MEASUREMENT; LEAD-FREE; LOW TEMPERATURES; NANOSOLDER; REFLOW;

LEAD-FREE SOLDERS;

EID: 84987837754     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.106     Document Type: Conference Paper

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