Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

Applied Surface Science

Volumn 258, Issue 19, 2012, Pages 7507-7514

  Gao, Fan ^a   Rajathurai, Karunaharan ^a   Cui, Qingzhou ^a   Zhou, Guangwen ^b   Nkengforacha, Irene ^a   Gu, Zhiyong ^a  

^a University of Massachusetts   (United States)

^b State University of New York   (United States)

Author keywords

Flux; Melting; Nanoelectronics assembly; Nanosolder; Nanowires; Surface oxide

Indexed keywords

BALL GRID ARRAYS; FLUXES; MELTING; NANOELECTRONICS; NANORODS; NANOWIRES; OSTWALD RIPENING; SOLDERED JOINTS; TIN; TIN OXIDES;

ASSEMBLY PROCESS; FUNDAMENTAL PROPERTIES; MICROSCOPIC IMAGING; NANOELECTRONICS ASSEMBLIES; NANOSCALE ASSEMBLIES; NANOSOLDER; NANOWIRES/NANORODS; SURFACE OXIDE;

LEAD-FREE SOLDERS;

EID: 84861340431     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.04.074     Document Type: Article

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