Numerical simulation of flow and conjugate heat transfer in a microchannel for electronics cooling

Journal of Electronics Manufacturing

Volumn 9, Issue 2, 1999, Pages 141-153

  Ng, E Y K ^a   Tso, C P ^a   Wen, Z M ^b   Choo, K F ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b DSO NATIONAL LABORATORIES   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COMPUTER SOFTWARE; COOLING; HEAT TRANSFER; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE DISTRIBUTION;

MICROCHANNEL HEAT SINKS; SOFTWARE PACKAGE STAR-CD;

HEAT SINKS;

EID: 0033297003     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000076     Document Type: Article

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