Non-metallurgical bonding technology with super-narrow gap for 3D stacked LSI

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 285-288

  Umemoto, M ^a   Tanida, K ^a   Tomita, Y ^a   Takahashi, T ^a   Takahashi, K ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; METALLURGY; OHMIC CONTACTS;

CHIP STACKING; FINE PITCH; HIGH SPEED SIGNAL TRANSMISSION; HIGH-DENSITY PACKAGING; HYPERFINES; METALLURGICAL BONDING; STRONG DEMAND; THIN CHIPS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84964649222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185684     Document Type: Conference Paper

References (8)

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