Copper micro and nano particles mixture for 3D interconnections application

2015 International 3D Systems Integration Conference, 3DIC 2015

Volumn , Issue , 2015, Pages TS8.9.1-TS8.9.5

  Dai, Yuan Yuan ^a   Ng, Mei Zhen ^a   Anantha, P ^a   Gan, Chee Lip ^a   Tan, Chuan Seng ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

conductive paste; copper particles; low temperature sintering; packing density

Indexed keywords

COPPER; INTEGRATED CIRCUIT INTERCONNECTS; MONTE CARLO METHODS; SINTERING; TEMPERATURE; THERMOGRAVIMETRIC ANALYSIS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

CONDUCTIVE PASTES; COPPER NANOPARTICLES; COPPER PARTICLES; FACE CENTERED CUBIC STRUCTURE; LOW-TEMPERATURE SINTERING; MICRO AND NANO-PARTICLE; PACKING DENSITY; WEIGHT PERCENTAGES;

NANOPARTICLES;

EID: 84962207020     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2015.7334614     Document Type: Conference Paper

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