Capacitive transducer strengthening via ald-enabled partial-gap filling

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Volumn , Issue , 2008, Pages 208-211

  Hung, Li Wen ^a   Jacobson, Zachery A ^a   Ren, Zeying ^a   Javey, Ali ^a   Nguyen, Clark T C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ATOMIC LAYER DEPOSITION; COUPLINGS; DIELECTRIC MATERIALS; ELECTRODES; ELECTROMECHANICAL COUPLING; ELECTROMECHANICAL DEVICES; HIGH-K DIELECTRIC; MICROMECHANICAL RESONATORS; MICROSYSTEMS;

BOARD-LEVEL; CAPACITIVE TRANSDUCERS; ELECTRO MECHANICAL COUPLING FACTORS; FIGURE OF MERIT (FOM); MICROMECHANICAL FILTER; OVERLAP CAPACITANCE; PROCESS TECHNOLOGIES; TERMINATION RESISTANCE;

SOLID-STATE SENSORS;

EID: 84961611564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31438/trf.hh2008.55     Document Type: Conference Paper

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