Contribution of surface energy and roughness to the wettability of polyamide 6 and polypropylene film in the plasma-induced process

Textile Research Journal

Volumn 86, Issue 5, 2016, Pages 461-471

  Kim, Jooyoun ^a   Kim, Hey Sang ^b   Park, Chung Hee ^b  

^a KANSAS STATE UNIVERSITY   (United States)

^b Seoul National University   (South Korea)

Author keywords

contact angle; plasma etching; plasma enhanced chemical vapor deposition; surface energy; wettability

Indexed keywords

COATINGS; CONTACT ANGLE; INTERFACIAL ENERGY; PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA ETCHING; PLASTIC FILMS; POLYPROPYLENES; SUBSTRATES; SURFACE ROUGHNESS;

ENERGY COMPONENTS; HEXAMETHYL DISILOXANE; HYDROPHILIC PROPERTIES; POLY-PROPYLENE FILM; POLYMERIC SURFACES; SURFACE WETTABILITY; TREATMENT CONDITIONS; WATER CONTACT ANGLE;

WETTING;

EID: 84957810956     PISSN: 00405175     EISSN: 17467748     Source Type: Journal    
DOI: 10.1177/0040517515580511     Document Type: Article

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