Effect of absorbed moisture on the atmospheric plasma etching of polyamide fibers

Surface and Coatings Technology

Volumn 202, Issue 10, 2008, Pages 1966-1974

  Zhu, Lu ^a,b   Teng, Weihua ^a,b   Xu, Helan ^a,b   Liu, Yan ^a,b   Jiang, Qiuran ^a,b   Wang, Chunxia ^a,b,c   Qiu, Yiping ^a,b  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^b DONGHUA UNIVERSITY   (China)

^c YANCHENG INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Atmospheric pressure plasma; Moisture regain; Plasma etching; Polyamide; SEM

Indexed keywords

ATOMIC FORCE MICROSCOPY; ETCHING; MOISTURE; MOLECULAR STRUCTURE; POLYETHYLENES; SCANNING ELECTRON MICROSCOPY; SURFACE MORPHOLOGY; SURFACE TREATMENT; SYNTHETIC FIBERS;

ATMOSPHERIC PRESSURE PLASMA; POLYAMIDE FIBERS; POLYPHENYLENE TEREPHTHALAMIDE; ULTRAHIGH MODUUS POLYETHYLENE;

POLYAMIDES;

ATOMIC FORCE MICROSCOPY; ETCHING; MOISTURE; MOLECULAR STRUCTURE; POLYAMIDES; POLYETHYLENES; SCANNING ELECTRON MICROSCOPY; SURFACE MORPHOLOGY; SURFACE TREATMENT; SYNTHETIC FIBERS;

EID: 38049132004     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.08.046     Document Type: Article

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