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Volumn 2015-August, Issue , 2015, Pages T122-T123
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Cu diffusion barrier: Graphene benchmarked to TaN for ultimate interconnect scaling
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Author keywords
[No Author keywords available]
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Indexed keywords
DIELECTRIC MATERIALS;
DIFFUSION BARRIERS;
GRAPHENE;
BARRIER MATERIAL;
BARRIER PERFORMANCE;
BARRIER THICKNESS;
CU DIFFUSION BARRIER;
EFFECTIVE RESISTIVITY;
INDUSTRY STANDARDS;
MEAN TIME TO FAILS;
TIME DEPENDENT DIELECTRIC BREAKDOWN;
INTEGRATED CIRCUIT INTERCONNECTS;
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EID: 84951148592
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/VLSIT.2015.7223713 Document Type: Conference Paper |
Times cited : (26)
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References (12)
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