Surface cleaning mechanisms and future cleaning requirements

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn 2000-January, Issue , 2000, Pages 328-333

  Busnaina, A A ^a   Lin, H ^a   Moumen, N ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

Acoustic applications; Adhesives; Brushes; Chemical processes; Electronics industry; Frequency; Hydrodynamics; Laboratories; Semiconductor device manufacture; Surface cleaning

Indexed keywords

ADHESIVES; BRUSHES; CHEMICAL CLEANING; ELECTRONICS INDUSTRY; HYDRODYNAMICS; LABORATORIES; MANUFACTURE; PARTICLE SIZE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SURFACE CLEANING;

ACOUSTIC APPLICATION; CHEMICAL PROCESS; CLEANING PARAMETERS; CLEANING REQUIREMENTS; FREQUENCY; MEGASONIC CLEANING; PARTICLE REMOVAL; SEMICONDUCTOR MANUFACTURING;

CLEANING;

EID: 84949781552     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2000.902608     Document Type: Conference Paper

References (10)

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6. Busnaina, A. A. and Gale, G. W, Journal of Particulate Science and Technology, Vol. 17, Issue 3, 1999.
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8. Zhang, F., Busnaina, A. A. and Fury, M., "The Removal of Deformed Submicron Particles from Silicon Wafers Using Spin Rinse and Megasonics," Journal of Electronic Materials, in press, 2000.
9. Zhang, F. and Busnaina, A. A., "Submicron Particle Removal in Post-oxide Chemical-mechanical Planarization (CMP) Cleaning" Applied Physics A 69 (1999) 4, 437-440.
10. Zhang, F., Busnaina, A. and Ahmadi, G., "Particle Adhesion and Removal in Chemical Mechanical Polishing (CMP) and post-CMP Cleaning," Journal of Electrochemical Society. Soc., Vol. 146, No. 7, 1999.