Removal of deformed submicron particles from silicon wafers by spin rinse and megasonics

Journal of Electronic Materials

Volumn 29, Issue 2, 2000, Pages 199-204

  Zhang, Fan ^a   Busnaina, Ahmed A ^b   Fury, Michael A ^c   Wang, Shi Qing ^a  

^a HONEYWELL   (United States)

^b CLARKSON UNIVERSITY   (United States)

^c Silterra   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ULTRASONIC CLEANING;

MEGASONIC CLEANING; SPIN RINSE;

SILICON WAFERS;

EID: 0033877376     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0142-0     Document Type: Article

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