Chip-package co-design of a 4.7 GHz VCO

Proceedings of the International Conference on Microelectronics, ICM

Volumn 2000-January, Issue , 1999, Pages 145-148

  Donnay, S ^a   Vaesen, K ^a   Pieters, P ^a   Diels, W ^a   Wambacq, P ^a   De Raedt, W ^a   Beyne, E ^a   Engels, M ^a   Bolsens, I ^a  

^a IMEC   (Belgium)

Author keywords

Band pass filters; CMOS process; CMOS technology; Costs; Inductors; Integrated circuit technology; Packaging; Radio frequency; Transceivers; Voltage controlled oscillators

Indexed keywords

BANDPASS FILTERS; CHIP SCALE PACKAGES; CIRCUIT OSCILLATIONS; CMOS INTEGRATED CIRCUITS; COSTS; ELECTRIC INDUCTORS; INTEGRATED CIRCUIT DESIGN; MICROELECTRONICS; OSCILLATORS (ELECTRONIC); OSCILLISTORS; PACKAGING; TRANSCEIVERS; VARIABLE FREQUENCY OSCILLATORS; WIRELESS TELECOMMUNICATION SYSTEMS;

CHIP PACKAGE CODESIGN; CMOS PROCESSS; CMOS TECHNOLOGY; INTEGRATED CIRCUIT TECHNOLOGY; INTEGRATED PASSIVES; MCM-D TECHNOLOGY; RADIO FREQUENCIES; WIRELESS COMMUNICATION APPLICATIONS;

RADIO TRANSCEIVERS;

EID: 84949752663     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICM.2000.884826     Document Type: Conference Paper

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