60-ghz flip-chip assembled mic design considering chip-substrate effect

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 12, 1997, Pages 2261-2266

  Arai, Yukari ^a   Sato, Masakatsu ^a   Yamada, Hiromi T ^a   Hamada, Tomoji ^a   Nagai, Kiyoshi ^a   Fujishiro, Hiroki I ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

Circuit modeling; Electromagnetic analysis; Electron beam lithography; Hybrid integrated circuits; Integrated circuit modeling; Millimeter wave circuits; Millimeter wave technology; MODFET

Indexed keywords

ELECTROMAGNETIC FIELD EFFECTS; ELECTRON BEAM LITHOGRAPHY; EQUIVALENT CIRCUITS; FLIP CHIP DEVICES; FREQUENCY MULTIPLYING CIRCUITS; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MILLIMETER WAVE DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MODELS;

MODULATION DOPED FIELD EFFECT TRANSISTORS (MODFET);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 85073885723     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.643829     Document Type: Article

References (7)

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