MCM-D implementation of passive RF components: Chip/package tradeoffs

Proceedings - 1998 IEEE Symposium on IC/Package Design Integration, IPDI 1998

Volumn 1998-February, Issue , 1998, Pages 100-104

  Frye, Robert C ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUITS; INTEGRATION;

COST EFFECTIVE; COUPLED DESIGNS; DESIGN METHODOLOGY; FREQUENCY RANGES; HIGH QUALITY FACTORS; MCM-D TECHNOLOGY; ON-CHIP INTEGRATION; RF COMPONENTS;

INTEGRATED CIRCUIT DESIGN;

EID: 2442636647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPDI.1998.663637     Document Type: Conference Paper

References (11)

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