Temperature effect on antenna protection strategy for plasma-process induced charging damage

International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings

Volumn 2002-January, Issue , 2002, Pages 134-137

  Wang, Zhichun ^a   Scarpa, A ^b   Smits, S ^a   Salm, C ^a   Kuper, F ^a,b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Plasma properties; Plasma simulation; Plasma temperature; Protection; Semiconductor diodes; Testing

Indexed keywords

ANTENNAS; DRAIN CURRENT; MATERIALS TESTING; PLASMA APPLICATIONS; PLASMA DEVICES; PLASMA SIMULATION; SEMICONDUCTOR DEVICES; TEMPERATURE; TESTING;

PLASMA MATERIALS-PROCESSING; PLASMA MEASUREMENT; PLASMA PROPERTIES; PLASMA TEMPERATURE; PROTECTION;

SEMICONDUCTOR DIODES;

EID: 84948737874     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PPID.2002.1042627     Document Type: Conference Paper

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