P-107: Mechanism of peel-off of metal substrate for flexible devices

Digest of Technical Papers - SID International Symposium

Volumn 40, Issue 1, 2009, Pages 1516-1519

  Kim, Soo Young ^a   Kim, Kisoo ^a   Hong, Kihyon ^a   Kim, Sung Jun ^a   Lee, Jong Lam ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AUTOMOBILE MANUFACTURE; GLASS; ORGANIC LIGHT EMITTING DIODES (OLED);

ADHESIVE ENERGY; FLEXIBLE DEVICE; GLASS SUBSTRATES; INNOVATIVE APPROACHES; METAL SUBSTRATE;

SUBSTRATES;

EID: 84945181631     PISSN: 0097966X     EISSN: 21680159     Source Type: Conference Proceeding    
DOI: 10.1889/1.3256601     Document Type: Conference Paper

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