Adhesion strength and mechanism of poly(imide-siloxane) to alloy 42 leadframe

Journal of Adhesion Science and Technology

Volumn 15, Issue 8, 2001, Pages 913-928

  Kang, J H ^a   Cho, K ^a   Park, C E ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Adhesion strength; Attenuated total reflectance Fourier transform infrared spectroscopy (ATR FTIR); Lead on chip (LOC) packaging; Poly(imide siloxane); Time of flight secondary ion mass spectroscopy (TOF SIMS); X ray photoelectron spectroscopy (XPS)

Indexed keywords

ADHESION; CHEMICAL BONDS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MOLECULAR STRUCTURE; PRESSURE EFFECTS; PYROLYSIS; SECONDARY ION MASS SPECTROMETRY; SYNTHESIS (CHEMICAL); THERMAL EFFECTS; THERMOOXIDATION; ALLOYS; BOND STRENGTH (MATERIALS); METALLIC COMPOUNDS; MICROCHANNELS; REFLECTION; SILICONES; X RAY PHOTOELECTRON SPECTROSCOPY;

THERMO-OXIDATIVE DECOMPOSITION;

POLYIMIDES; CERIUM ALLOYS;

ADHESION MECHANISMS; ATR FTIR; ATTENUATED TOTAL REFLECTANCE FOURIER TRANSFORM INFRARED SPECTROSCOPY; FENI ALLOYS; HYDROXY GROUPS; LEAD-FRAME; METAL OXIDES; MOLDING TEMPERATURE; POLY(IMIDE-SILOXANE); POLYDIMETHYLSILOXANE PDMS; SILANOL GROUPS; THERMO-OXIDATIVE DECOMPOSITION; TIME-OF-FLIGHT SECONDARY ION MASS SPECTROSCOPY; X-RAY PHOTOELECTRON SPECTROSCOPY(XPS);

EID: 0034781940     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/15685610152542360     Document Type: Article

References (3)

1. D. Suryanarayana and K. L. Mittal, J. Appl. Polym. Sci. 30, 3107 (1985).
2. H. G. Linde, J. Polym. Sci. Polym. Phys. 26, 1149 (1988).
3. T. H. Yoon, C. A. Arnold-McKenna and J. E. McGrath, J. Adhesion 39, 15 (1992).