3D integration using self-assembly at air-water interface

Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop

Volumn , Issue , 2012, Pages 421-424

  Park, K S ^a   Varel, C ^a   Hoo, J H ^a   Baskaran, R ^a,b   Bohringer K F ^a  

^a University of Washington   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; AIR; INTEGRATION; MICROSYSTEMS; SELF ASSEMBLY; SOLDERING; SOLID-STATE SENSORS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

3-D INTEGRATION; AIR WATER INTERFACES; MECHANICAL BONDING; NUMBER OF LAYERS; PROOF OF CONCEPT; REFLOW PROCESS; SOLDER REFLOW; VIA RESISTANCE;

PHASE INTERFACES;

EID: 84944685939     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31438/trf.hh2012.112     Document Type: Conference Paper

References (16)

1. A. B. Kahng, "Scaling: More than Moore's law," Design & Test of Computers, IEEE, vol. 27, pp. 86-87, 2010.
2. S. V. Gaste. (2010, Assembling the Next Electronic Equipment Generations. Available: http://www.assembleon.com/about/475874/475882/Future-placement-requirements
3. S. A. Stauth and B. A. Parviz, "Self-assembled single-crystal silicon circuits on plastic," Proceedings of the National Academy of Sciences of the United States of America, vol. 103, pp. 13922-13927, 2006.
4. H. O. Jacobs, et al., "Fabrication of a cylindrical display by patterned assembly," SCIENCE, vol. 296, pp. 323-325, 12 APRIL 2002 2002.
5. W. Zheng, et al., "Sequential shape-and-solder-directed self-assembly of functional microsystems," Proceedings of the National Academy of Sciences of America, vol. 101, pp. 12814-12817, 2004.
6. W. Zheng, et al., "Fluidic heterogeneous microsystems assembly and packaging," Journal of Microelectromechanical Systems, vol. 15, pp. 864-870, 2006.
7. J. Tien, et al., "Microfabrication through electrostatic self-assembly," Langmuir, vol. 13, pp. 5349-5355, 1997.
8. S. B. Shetye, et al., "Self-assembly of millimeter-scale components using integrated micromagnets," IEEE Transactions on Magnetics, vol. 44, pp. 4293-4296, 2008.
9. H. Ye, et al., "Integrating nanowires with substrates using directed assembly and nanoscale soldering," IEEE Transactions on Nanotechnology vol. 5, pp. 62-66, 2006.
10. R. J. Knuesel and H. O. Jacobs, "Self-assembly of microscopic chiplets at a liquid-liquid-solid interface forming a flexible segmented monocrystalline solar cell," Proceedings of the National Academy of Sciences of America, vol. 107, pp. 993-998, 2010.
11. M. Boncheva, et al., "Millimeter-scale self-assembly and its applications," Pure and Applied Chemistry, vol. 75, pp. 621-630, 2003.
12. K. S. Park, et al., "Mechanics and scaling of thin part assembly at a fluidic interface," Journal of Micromechanics and Microengineering, vol. 21, p. 025002, 2011.
13. T. B. Benjamin and F. Ursell, "The Stability of the Plane Free Surface of a Liquid in Vertical Periodic Motion," Proceedings of the Royal Society of London. Series A, Mathematical and Physical Sciences, vol. 225, pp. 505-515, 1954.
14. S. Douady and S. Fauve, "Pattern Selection in Faraday Instability," Europhysics Letters, vol. 6, pp. 221-226, 1988.
15. K. S. Park, et al., "Orientation-specific self-assembly at air-water interface using magnetic field," presented at Transducers 2011, Beijing, China, 2011.
16. T. Fujita, et al., "Seedlayer-less gold electroplating on silicon surface for MEMS applications," Sensors and Actuators A: Physical, vol. 135, pp. 50-57, 2007.