Seedlayer-less gold electroplating on silicon surface for MEMS applications

Sensors and Actuators, A: Physical

Volumn 135, Issue 1, 2007, Pages 50-57

  Fujita, Takayuki ^a   Nakamichi, Suguru ^a   Ioku, Sunao ^a   Maenaka, Kazusuke ^a   Takayama, Yoichiro ^a  

^a UNIVERSITY OF HYOGO   (Japan)

Author keywords

Direct electroplating; Gold; MEMS; Seedlayer less

Indexed keywords

ANNEALING; BIOCOMPATIBILITY; ELECTRIC CONDUCTIVITY; GOLD; INFRARED RADIATION; MEMS; SILICON;

DIRECT ELECTROPLATING; ELECTROPLATING FILMS; PHYSICOCHEMICAL STABILITY; SEEDLAYER LESS;

ELECTROPLATING;

EID: 33947248074     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.10.058     Document Type: Article

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