Design, fabrication and test of an integrated multi-microchannel heat sink for electronics cooling

Sensors and Actuators, A: Physical

Volumn 235, Issue , 2015, Pages 14-27

  Silverio V ^a,b   Cardoso, S ^b,c   Gaspar, J ^d   Freitas, Paulo P ^b,c,d   Moreira, A L N ^a,b  

^a Centre for Innovation Technology and Policy Research   (Portugal)

^b INSTITUTO SUPERIOR TÉCNICO   (Portugal)

^c INESC   (Portugal)

^d INTERNATIONAL IBERIAN NANOTECHNOLOGY LABORATORY   (Portugal)

Author keywords

Electronic cooling; Micro heat transfer; Microchannel heat sink; Microfabrication; Thin film thermal sensors

Indexed keywords

ATMOSPHERIC TEMPERATURE; COOLANTS; ELECTRONIC COOLING; FABRICATION; FLUID DYNAMICS; GEOMETRY; GLASS BONDING; HEAT SINKS; HEAT TRANSFER; MICROCHANNELS; MICROFABRICATION; REYNOLDS NUMBER; TEMPERATURE; TEMPERATURE MEASUREMENT; THIN FILMS;

CONSTANT WALL HEAT FLUX; LENGTH TO DIAMETER RATIO; MEMS FABRICATION TECHNIQUES; MICRO CHANNEL HEAT SINKS; SURFACE TEMPERATURES; TEMPERATURE COEFFICIENT OF ELECTRICAL RESISTIVITY; THERMAL SENSORS; THERMO-FLUID DYNAMICS;

HEAT FLUX;

EID: 84943531360     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2015.09.023     Document Type: Article

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