Modeling and microstructural characterization of incubation, time-dependent drift and saturation during electromigration in Al-Si-Cu stripes

Microelectronics Reliability

Volumn 39, Issue 11, 1999, Pages 1603-1616

  Witvrouw, A ^a   Bender, H ^a   Roussel, Ph ^a   Maex, K ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTROMIGRATION; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PASSIVATION;

CONTACT MIGRATION CHAINS;

MICROELECTRONICS;

EID: 0033221608     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00178-X     Document Type: Article

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