Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling

Proceedings - Electronic Components and Technology Conference

Volumn 2015-July, Issue , 2015, Pages 1866-1873

  Weber, Constanze ^a   Hutter, Matthias ^a   Schmitz, Stefan ^a   Lang, Klaus Dieter ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; LEAD-FREE SOLDERS; NETWORK COMPONENTS; POROSITY; SILVER; SILVER ALLOYS; SINTERING; TIN ALLOYS; TIN METALLOGRAPHY;

ACTIVE POWER; APPLIED PRESSURE; CREEP FATIGUE; DIE-ATTACH; LAYER THICKNESS; PRESSURE-LESS SINTERING; SINTERED JOINT; SOLDER JOINTS;

SILVER METALLOGRAPHY;

EID: 84942094327     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2015.7159854     Document Type: Conference Paper

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