Novel interconnect materials for high reliability power converters with operation temperatures above 150°C

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 416-422

  Duch, Susanne ^a   Krebs, Thomas ^a   Loewer, Yvonne ^a   Schmitt, Wolfgang ^a   Thomas, Muriel ^a  

^a Heraeus Materials Technology GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE OPERATIONS; HIGH POWER SEMICONDUCTORS; HIGH RELIABILITY; HIGH THERMAL; INTERCONNECT MATERIALS; OPERATION TEMPERATURE; POWER DENSITIES; POWER RANGE; POWER SEMICONDUCTOR MODULE; SINTER MATERIAL; THERMAL AND ELECTRICAL CONDUCTIVITY; THERMOMECHANICAL STABILITY; WIDE FIELD;

COST REDUCTION; ELECTRIC CONDUCTIVITY; POWER ELECTRONICS; SINTERING;

RELIABILITY;

EID: 84866881005     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248864     Document Type: Conference Paper

References (6)

1. J. Lutz, H. Schlangenotto, U. Scheuermann, R. De Doncker, "Semiconductor Power Devices: Physics, Characteristics, Reliability", Springer-Verlag Berlin Heidelberg 2011.
2. B. K. Bose, "The past, present and future of power electronics", Industrial Electronics Magazine 2009, Vol: 3, Issue: 2, pp 7-11
3. C. Göbl: Low temperature sinter technology Die attachment for power electronic applications, CIPS 2010 Nuremberg
4. Sven Klaka: Eine Niedertemperatur-Verbindungstechnik zum Aufbau von Leistungshalbleitermodulen, 1995, ISBN 3-89588
5. Christian Mertens: Die Niedertemperaturver-bindungstechnikder Leistungselektronik, 2004, ISBN 3-18-336521-9
6. Jacek Rudzki: Reliability of Ag Sintering vs. Soldering, ECPE Workshop Paris 2009