Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics

IEEE International Reliability Physics Symposium Proceedings

Volumn 2004-January, Issue January, 2004, Pages 68-73

  Chen, F ^a   Gill, J ^a   Harmon, D ^a   Sullivan, T ^a   Li, B ^a   Strong, A ^a   Rathore, H ^a   Edelstein, D ^b   Yang, C C ^a   Cowley, A ^a   Clevenger, L ^a  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Cu interconnect; Electromigration; Heat conduction; ILD; Joule heating; Low k; Reliability; Thermal conductivity

Indexed keywords

DIELECTRIC MATERIALS; ELECTROMIGRATION; GLASS; HEAT CONDUCTION; INTEGRATED CIRCUIT INTERCONNECTS; JOULE HEATING; RELIABILITY; SILICATES; THERMAL CONDUCTIVITY OF SOLIDS;

BULK THERMAL CONDUCTIVITY; CU INTERCONNECT; EFFECTIVE CONDUCTIVITY; EFFECTIVE THERMAL CONDUCTIVITY; HEAT CONDUCTION MODELS; ILD; INTERCONNECT STRUCTURES; THIN DIELECTRIC LAYER;

THERMAL CONDUCTIVITY;

EID: 84932133441     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2004.1315303     Document Type: Conference Paper

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