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Lab on a Chip

Volumn 15, Issue 9, 2015, Pages 1998-2001

Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems

(4) Kistrup, K a Poulsen, C E a Hansen, M F a Wolff, A a

a TECHNICAL UNIVERSITY OF DENMARK (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

POLYMER;

ARTICLE; CHEMICAL BINDING; CONCENTRATION (PARAMETERS); HEATING; LAB ON A CHIP; MICROFLUIDICS; MICROTECHNOLOGY; POWER SUPPLY; PRIORITY JOURNAL; SOLID PHASE EXTRACTION; ULTRASONIC WELDING; ULTRASOUND; VIBRATION; WELDING; CHEMISTRY; PROCEDURES;

LAB-ON-A-CHIP DEVICES; POLYMERS; ULTRASONIC WAVES; WELDING;

EID: 84928529150 PISSN: 14730197 EISSN: 14730189 Source Type: Journal
DOI: 10.1039/c5lc00174a Document Type: Article

Times cited : (33)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.