Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Microsystem Technologies

Volumn 14, Issue 2, 2008, Pages 179-184

  Kim, Dong Sung ^a   Lee, Hyun Sup ^b   Han, Jungyoup ^c   Lee, Se Hwan ^c   Ahn, Chong H ^c   Kwon, Tai Hun ^b  

^a Chung Ang University   (South Korea)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c University of Cincinnati   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; HOT PRESSING; MICROPROCESSOR CHIPS; PLASTICS;

HOLED PRESSURE EQUALIZING PLATE (HPEP); MICROCHAMBERS; THERMAL BONDING;

MICROSYSTEMS;

EID: 35148838438     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0416-z     Document Type: Article

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