SCOPUS 정보 검색 플랫폼

Volumn 87, Issue 11, 2010, Pages 2429-2436

Ultrasonic bonding for thermoplastic microfluidic devices without energy director

(4) Luo, Yi a Zhang, Zongbo a Wang, Xiaodong a Zheng, Yingsong a

a DALIAN UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Microfluidic device; Multilayer microfluidic device; Solvent assisted ultrasonic bonding; Thermal assisted ultrasonic bonding; Ultrasonic bonding

Indexed keywords

BONDING INTERFACES; BONDING METHODS; BONDING PROCESS; BONDING TIME; CRITICAL AMPLITUDES; GLASS TRANSITION TEMPERATURE; HIGH THROUGHPUT; INTERFACIAL TEMPERATURE; LOCALIZED HEATING; MASS PRODUCTION; MICRO-FLUIDIC DEVICES; MOLTEN POLYMERS; POLYMER MEMS; POLYMER MICROFLUIDICS; ULTRASONIC BONDING;

FLUIDIC DEVICES; GLASS TRANSITION; MICROFLUIDICS; MICROSTRUCTURE; MULTILAYERS; POLYMERS; REINFORCED PLASTICS; SOLVENTS; TENSILE STRENGTH; THROUGHPUT; ULTRASONICS;

GLASS BONDING;

EID: 77955516334 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2010.04.020 Document Type: Article

Times cited : (37)

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