Ultrathin, Ultrasmooth Gold Layer on Dielectrics without the Use of Additional Metallic Adhesion Layers

ACS Applied Materials and Interfaces

Volumn 7, Issue 10, 2015, Pages 5797-5802

  Leandro, Lorenzo ^a   Malureanu, Radu ^a   Rozlosnik, Noemi ^b   Lavrinenko, Andrei ^a  

^a Department of Photonics Engineering ^*  (Denmark)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

6 nm gold complete layer; aminosilane; hyperbolic metamaterials; nonmetallic adhesion layer; plasmonics; ultrasmooth

Indexed keywords

GOLD; PLASMONIC METAMATERIALS; PLASMONICS; SILICON WAFERS;

6 NM GOLD COMPLETE LAYER; ADHESION LAYER; AMINOSILANES; AVERAGE HEIGHT; NOMINAL THICKNESS; OPTICAL CHARACTERISTICS; RESEARCH FIELDS; ULTRASMOOTH;

ADHESION;

EID: 84925356486     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am508681u     Document Type: Article

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