Ultrasmooth patterned metals for plasmonics and metamaterials

Science

Volumn 325, Issue 5940, 2009, Pages 594-597

  Nagpal, Prashant ^a   Lindquist, Nathan C ^a   Oh, Sang Hyun ^a   Norris, David J ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL; METAMATERIAL; NANOMATERIAL; SILICON; UNCLASSIFIED DRUG;

ELECTROMAGNETIC WAVE; ELECTRON; SCATTERING; SILICON; SURFACE ROUGHNESS;

ARTICLE; BIOFILM; COMPOSITE MATERIAL; CRYSTAL STRUCTURE; ELECTRON; HIGH THROUGHPUT SCREENING; LIGHT SCATTERING; NANOFABRICATION; OPTICS; OSCILLATION; PARTICLE SIZE; PLASMONICS; PRIORITY JOURNAL; RAMAN SPECTROMETRY; REMOTE SENSING; SURFACE PLASMON RESONANCE; SURFACE PROPERTY;

COPPER; ELECTRONS; GOLD; LIGHT; MATERIALS TESTING; METALS; NANOSTRUCTURES; NANOTECHNOLOGY; OPTICS AND PHOTONICS; RADIATION; SILICON; SILVER; SPECTRUM ANALYSIS, RAMAN; SURFACE PLASMON RESONANCE;

EID: 68149120318     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1174655     Document Type: Article

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31. We thank K. Bantz and C. Haynes for help with SERS measurements and B. Carlson for help with x-ray photoelectron spectroscopy. This work was supported by the U.S. Department of Energy (grant DE-FG0206ER46438) and used resources in the Institute of Technology at the University of Minnesota, including the Nanofabrication Center, which receives partial support from NSF through the National Nanotechnology Infrastructure Network program, and the Characterization Facility, which has received capital equipment funding from NSF through the Materials Research Science and Engineering Center, Major Research Instrumentation, and Engineering Research Center programs. S.-H.O. acknowledges support from a Minnesota Partnership for Biotechnology Award and a 3M Non-Tenured Faculty Award. P.N. and N.C.L. acknowledge support from a University of Minnesota doctoral dissertation fellowship and an NIH Biotechnology training grant, respectively. The authors have applied for a patent on the fabrication methods described.