Thermal stability and electrical properties of Ag-Ti films and Ti/Ag/Ti films prepared by sputtering

Vacuum

Volumn 87, Issue , 2013, Pages 222-226

  Kawamura, M ^a   Zhang, Z ^a   Kiyono, R ^a   Abe, Y ^a  

^a KITAMI INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Ag Ti alloy film; Agglomeration suppression; Resistivity; Surface morphology; Ti Ag Ti multilayered film

Indexed keywords

AGGLOMERATION; ALLOYING ELEMENTS; ELECTRIC CONDUCTIVITY; FILM PREPARATION; METALLIC FILMS; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; STABILITY; SURFACE MORPHOLOGY; THERMODYNAMIC STABILITY; THIN FILMS; TITANIUM; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESIVE STRENGTH; AG THIN FILMS; AGGLOMERATION SUPPRESSION; HIGH THERMAL STABILITY; IMPURITY SCATTERING; LOW RESISTIVITY; MULTI-LAYERED FILMS; TI ALLOYS;

TITANIUM ALLOYS;

EID: 84924200876     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2012.02.021     Document Type: Article

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