Agglomeration behavior of Ag films suppressed by alloying with some elements

Vacuum

Volumn 83, Issue 3, 2008, Pages 610-613

  Sugawara, K ^a   Minamide, Y ^a   Kawamura, M ^a   Abe, Y ^a   Sasaki, K ^a  

^a KITAMI INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Ag alloy films; Agglomeration suppression; Sputtering; Surface morphology

Indexed keywords

AGGLOMERATION; ALLOYING ELEMENTS; ALUMINUM; ANNEALING; ATOMIC PHYSICS; ATOMS; COPPER; COPPER ALLOYS; GOLD; METALLIC FILMS; OXIDE FILMS; POLARIZATION; SILVER ALLOYS; THICK FILMS; WEIGHT CONTROL;

AG ALLOY FILMS; AG FILMS; AGGLOMERATION SUPPRESSION; AL FILM; AL THIN FILMS; ANNEALING TEMPERATURES; AS-DEPOSITED; ATOM MIGRATION; AU FILMS; CU ATOMS; CU FILMS; DIFFERENT MECHANISMS; FILM SURFACES; OXIDE LAYERS; SPUTTERING; SURFACE MORPHOLOGY; VOID FORMATIONS;

SILVER;

EID: 52949083929     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.vacuum.2008.04.029     Document Type: Article

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