Comparison of the agglomeration behavior of Ag(Al) films and Ag(Au) films

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2476-2480

  Sugawara, K ^a   Kawamura, M ^a   Abe, Y ^a   Sasaki, K ^a  

^a KITAMI INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Ag(Al) films; Ag(Au) films; Agglomeration suppression; Morphology; Resistivity

Indexed keywords

AGGLOMERATION; ANNEALING; METALLIZING; MORPHOLOGY; SPUTTERING; WETTING;

AGGLOMERATION SUPPRESSION; METALLIZATION MATERIALS;

METALLIC FILMS;

EID: 34548850868     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.050     Document Type: Article

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