Innovative parametric design for environmentally conscious adhesive dispensing process

Journal of Intelligent Manufacturing

Volumn 26, Issue 1, 2015, Pages 1-12

  Huang, Chien Yi ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

58Bi 42Sn solder alloy; Adhesive dispensing; Artificial neural network; Electronics manufacturing; Innovative parametric design; Principal component analysis

Indexed keywords

CURING; ECODESIGN; ELECTRONICS INDUSTRY; NEURAL NETWORKS; PRINCIPAL COMPONENT ANALYSIS; SOLDERING;

ADHESION PERFORMANCE; ADHESIVE DISPENSING; ARTIFICIAL NEURAL NETWORK MODELS; ELECTRONICS MANUFACTURING; GREY RELATIONAL ANALYSIS; PARAMETRIC DESIGN; SOLDER ALLOYS; SOLDERING TEMPERATURE;

ADHESIVES;

EID: 84921069356     PISSN: 09565515     EISSN: 15728145     Source Type: Journal    
DOI: 10.1007/s10845-013-0755-9     Document Type: Article

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