Optimizing the IC wire bonding process using a neural networks/genetic algorithms approach

Journal of Intelligent Manufacturing

Volumn 14, Issue 2, 2003, Pages 229-238

  Su, Chao Ton ^a   Chiang, Tai Lin ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b MINGHSIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Back propagation network; Genetic algorithms; Integrated circuit (IC); Neural networks; Wire bonding

Indexed keywords

BACKPROPAGATION; GENETIC ALGORITHMS; NEURAL NETWORKS; SEMICONDUCTOR MATERIALS;

WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0038341737     PISSN: 09565515     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1022959631926     Document Type: Review

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