DMAIC approach to improve the capability of SMT solder printing process

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 2, 2008, Pages 126-133

  Li, Ming Hsien C ^a   Al Refaie, Al Refaie A ^a   Yang, C Y ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Define Measure Analyze Improve Control (DMAIC); Process capability; Surface mount technology (SMT); Taguchi method

Indexed keywords

ANALYSIS OF VARIANCE (ANOVA); OPTIMIZATION; PRINTED CIRCUIT BOARDS; SIGNAL TO NOISE RATIO; TAGUCHI METHODS;

DEFINE-MEASURE-ANALYZE-IMPROVE-CONTROL (DMAIC); ORTHOGONAL ARRAY; SOLDER PRINTING PROCESS;

SURFACE MOUNT TECHNOLOGY;

EID: 42549108981     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.919342     Document Type: Article

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