Mechanical properties and joint reliability improvement of Sn-Bi alloy

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 492-496

  Wang, Jianhui ^a   Wen, Long ^a   Zhou, Jianwei ^a   Chung, Myungkee ^a  

^a Samsung Semiconductor (China) R and D Institute   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR; BALL SIZE; EUTECTIC ALLOYS; JOINT RELIABILITY; LEAD-FREE; LIFE-TIMES; LOW MELTING TEMPERATURES; SAC-SOLDERS; SN-AG-CU; SN-BI ALLOY; SOLDER BALLS;

CERIUM ALLOYS; DROPS; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84860895640     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184470     Document Type: Conference Paper

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