Effect of substrate on electroplated copper sulphide thin films

Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 12, 2014, Pages 5338-5344

  Bharathi, B ^a   Thanikaikarasan, S ^a   Kollu, Pratap ^b   Chandrasekar, P V ^a,c   Sankaranarayanan, K ^d   Shajan, X Sahaya ^a  

^a PSN COLLEGE OF ENGINEERING AND TECHNOLOGY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

^c FUZHOU UNIVERSITY   (China)

^d ALAGAPPA UNIVERSITY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; CRYSTALLITE SIZE; ENERGY GAP; FILM PREPARATION; LIGHT ABSORPTION; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SULFUR COMPOUNDS; SURFACE MORPHOLOGY; X RAY POWDER DIFFRACTION;

DIFFERENT SUBSTRATES; DISLOCATION DENSITIES; ELECTRODEPOSITION TECHNIQUE; ELECTROPLATED COPPER; ENERGY DISPERSIVE ANALYSIS; FILM COMPOSITION; MICROSTRUCTURAL PARAMETERS; X-RAY DIFFRACTION DATA;

THIN FILMS;

EID: 84912032010     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-2310-7     Document Type: Article

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