The curing kinetics and thermal properties of epoxy resins cured by aromatic diamine with hetero-cyclic side chain structure

Thermochimica Acta

Volumn 595, Issue , 2014, Pages 22-27

  Xiong, Xuhai ^a   Ren, Rong ^a   Liu, Siyang ^a   Lu, Shaowei ^a   Chen, Ping ^a,b  

^a SHENYANG AEROSPACE UNIVERSITY   (China)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aromatic amine; Curing kinetics; Epoxy resin; Phthalide structure; Thermal mechanical properties

Indexed keywords

AROMATIC AMINES; AROMATIC DIAMINE; CURING KINETICS; PHTHALIDE STRUCTURES; SIDE CHAIN STRUCTURE; THERMAL MECHANICAL PROPERTIES;

EPOXY RESINS;

EID: 84907833854     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2014.07.027     Document Type: Article

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