Novel silicon-modified phenolic novolac resins: Non-isothermal curing kinetics, and mechanical and thermal properties of their biofiber-reinforced composites

Thermochimica Acta

Volumn 575, Issue , 2014, Pages 244-253

  Bu, Zhiyang ^a   Hu, Jijiang ^a   Li, Bogeng ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Model free isoconversional method; Non isothermal curing; Silicon modified phenolic resins; Thermal resistance property

Indexed keywords

CURING BEHAVIOR; CURING KINETICS; MECHANICAL AND THERMAL PROPERTIES; MODEL FITTING; MODEL-FREE ISOCONVERSIONAL METHOD; MODIFIED PHENOLIC RESIN; NONISOTHERMAL; RESISTANCE PROPERTIES;

CURING; PHENOLIC RESINS; REINFORCEMENT; SILICON; SILICONES; SYNTHETIC RESINS;

ISOTHERMS;

EID: 84889675918     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2013.11.003     Document Type: Article

References (64)

1. Z. Fan, A. Lederer, and B. Voit Synthesis and characterization of A2 + B3-type hyperbranched aromatic polyesters with phenolic end groups Polymer 50 2009 3431 3439
2. C.-F. Huang, S.-W. Kuo, H.-C. Lin, J.-K. Chen, Y.-K. Chen, H. Xu, and F.-C. Chang Thermal properties, miscibility and specific interactions in comparison of linear and star poly(methyl methacrylate) blend with phenolic Polymer 45 2004 5913 5921 (Pubitemid 38993464)
3. H. Ma, G. Wei, Y. Liu, X. Zhang, J. Gao, F. Huang, B. Tan, Z. Song, and J. Qiao Effect of elastomeric nanoparticles on properties of phenolic resin Polymer 46 2005 10568 10573 (Pubitemid 41455291)
4. M. Wang, L. Wei, and T. Zhao A novel condensation-addition-type phenolic resin (MPN): Synthesis, characterization and evaluation as matrix of composites Polymer 46 2005 9202 9210 (Pubitemid 41328596)
5. Y. Zhang, S. Lee, M. Yoonessi, K. Liang, and C.U. Pittman Phenolic resin-trisilanolphenyl polyhedral oligomeric silsesquioxane (POSS) hybrid nanocomposites: structure and properties Polymer 47 2006 2984 2996
6. Y. Liu, Z.S. Lu, X.D. Chen, D. Wang, J.C. Liu, and L.J. Hu Study on phenolic-resin/carbon-fiber ablation composites modified with polyhedral oligomeric silsesquioxanes Fourth IEEE International Conference on Nano/Micro Engineered and Molecular Systems 1 and 2 2009 605 608
7. C.U. Pittman, G.Z. Li, and H.S. Cho Chemical bonding between phenolic resins and polyhedral oligomeric silsesquioxanes (POSS) in inorganic-organic hybrid nanocomposites J. Inorg. Organomet. Polym. 16 2006 43 59
8. S.W. Kuo, H.C. Lin, W.J. Huang, C.F. Huang, and F.C. Chang Hydrogen bonding interactions and miscibility between phenolic resin and octa(acetoxystyryl) polyhedral oligomeric silsesquioxane (AS-POSS) nanocomposites J. Polym. Sci., Part B: Polym. Phys. 44 2006 673 686
9. Y.D. Zhang, S.H. Lee, M. Yoonessi, H. Toghiani, and C.U. Pittman Phenolic resin/octa(aminophenyl)-T-8-polyhedral oligomeric silsesquioxane (POSS) hybrid nanocomposites: synthesis, morphology, thermal and mechanical properties J. Inorg. Organomet. Polym. 17 2007 159 171
10. H.C. Lin, S.W. Kuo, C.F. Huang, and F.C. Chang Thermal and surface properties of phenolic nanocomposites containing octaphenol polyhedral oligomeric silsesquioxane Macromol. Rapid Commun. 27 2006 537 541
11. M.R. Schutz, K. Sattler, S. Deeken, O. Klein, V. Adasch, C.H. Liebscher, U. Glatzel, J. Senker, and J. Breu Improvement of thermal and mechanical properties of a phenolic resin nanocomposite by in situ formation of silsesquioxanes from a molecular precursor J. Appl. Polym. Sci. 117 2010 2272 2277
12. Y.H. Liu, K. Zeng, and S.X. Zheng Organic-inorganic hybrid nanocomposites involving novolac resin and polyhedral oligomeric silsesquioxane React. Funct. Polym. 67 2007 627 635 (Pubitemid 46935534)
13. C.F. Huang, S.W. Kuo, F.J. Lin, W.J. Huang, C.F. Wang, W.Y. Chen, and F.C. Chang Influence of PMMA-chain-end tethered polyhedral oligomeric silsesquioxanes on the miscibility and specific interaction with phenolic blends Macromolecules 39 2006 300 308
14. Y.D. Zhang, S.H. Lee, M. Yoonessi, K.W. Liang, and C.U. Pittman Phenolic resin-trisilanolphenyl polyhedral oligorneric silsesquioxane (POSS) hybrid nanocomposites: structure and properties Polymer 47 2006 2984 2996
15. Y.J. Lee, S.W. Kuo, W.J. Huang, H.Y. Lee, and F.C. Chang Miscibility, specific interactions, and self-assembly behavior of phenolic/polyhedral oligomeric silsesquioxane hybrids J. Polym. Sci., Part B: Polym. Phys. 42 2004 1127 1136
16. B.A. Li, Y.W. Zheng, Z.F. Zheng, and X.Y. Zhao Characterization of boron modified phenolic resin and its curing behavior Fundam. Chem. Eng. 233-235 2011 137 141 Pts 1-3
17. M.O. Abdalla, A. Ludwick, and T. Mitchell Boron-modified phenolic resins for high performance applications Polymer 44 2003 7353 7359 (Pubitemid 37295996)
18. D.C. Wang, G.W. Chang, and Y. Chen Preparation and thermal stability of boron-containing phenolic resin/clay nanocomposites Polym. Degrad. Stab. 93 2008 125 133
19. R. Antony, and C.K.S. Pillai Synthesis and thermal characterization of chemically-modified phenolic resins J. Appl. Polym. Sci. 54 1994 429 438
20. M.A. Espinosa, M. Galia, and V. Cadiz Novel flame-retardant thermosets: phosphine oxide containing diglycidylether as curing agent of phenolic novolac resins J. Polym. Sci., Part A: Polym. Chem. 42 2004 3516 3526
21. G.H. Hsiue, S.J. Shiao, H.F. Wei, W.J. Kuo, and Y.A. Sha Novel phosphorus-containing dicyclopentadiene-modified phenolic resins for flame-retardancy applications J. Appl. Polym. Sci. 79 2001 342 349
22. A. Nordberg, P. Antoni, M.I. Montañez, A. Hult, H. Von Holst, and M. Malkoch Highly adhesive phenolic compounds as interfacial primers for bone fracture fixations ACS Appl. Mater. Interfaces 2 2010 654 657
23. E.C. Ramires, J.D. Megiatto, C. Gardrat, A. Castellan, and E. Frollini Biobased composites from glyoxal-phenolic resins and sisal fibers Bioresour. Technol. 101 2010 1998 2006
24. L.X. Zhong, S.Y. Fu, F. Li, and H.Y. Zhan Chlorine dioxide treatment of sisal fibre: surface lignin and its influences on fibre surface characteristics and interfacial behaviour of sisal fibre/phenolic resin composites Bioresources 5 2010 2431 2446
25. K. Joseph, S. Varghese, G. Kalaprasad, S. Thomas, L. Prasannakumari, P. Koshy, and C. Pavithran Influence of interfacial adhesion on the mechanical properties and fracture behaviour of short sisal fibre reinforced polymer composites Eur. Polym. J. 32 1996 1243 1250 (Pubitemid 126371037)
26. D.M. Jackson Jr., F.B. Oliveira, S.R. Derval, G. Christian, C. Alain, and F. Elisabete Renewable resources as reinforcement of polymeric matrices: composites based on phenolic thermosets and chemically modified sisal fibers Macromol. Biosci. 7 2007 1121 1131 (Pubitemid 47477906)
27. P. Jane Maria Faulstich de, and F. Elisabete Unmodified and modified surface sisal fibers as reinforcement of phenolic and lignophenolic matrices composites: thermal analyses of fibers and composites Macromol. Mater. Eng. 291 2006 405 417
28. J.D. Megiatto Jr., C.G. Silva, E.C. Ramires, and E. Frollini Thermoset matrix reinforced with sisal fibers: effect of the cure cycle on the properties of the biobased composite Polym. Test. 28 2009 793 800
29. P.A. Sreekumar, J.M. Saiter, K. Joseph, G. Unnikrishnan, and S. Thomas Electrical properties of short sisal fiber reinforced polyester composites fabricated by resin transfer molding Composites Part A 43 2012 507 511
30. J. Guo, Q. Rao, and Z. Xu Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound J. Hazard. Mater. 153 2008 728 734 (Pubitemid 351417583)
31. R. da Silva Santos, A.A. de Souza, M.-A. De Paoli, and C.M.L. de Souza Cardanol-formaldehyde thermoset composites reinforced with buriti fibers: preparation and characterization Composites Part A 41 2010 1123 1129
32. M. Zhan, and R.P. Wool Design and evaluation of bio-based composites for printed circuit board application Composites Part A 47 2013 22 30
33. M.L. Huang, and J.G. Williams Mechanisms of solidification of epoxy-amine resins during cure macromolecules 27 1994 7423 7428
34. R.A. Fava Differential scanning calorimetry of epoxy resins Polymer 9 1968 137 151
35. J.M. Barton The application of differential scanning calorimetry (DSC) to the study of epoxy resin curing reactions Adv. Polym. Sci. 72 1985 111 154
36. G. Micco, M. Giamberini, E. Amendola, C. Carfagna, and G. Astarita Modeling of curing reaction kinetics in liquid-crystalline epoxy resins Ind. Eng. Chem. Res. 36 1997 2976 2983 (Pubitemid 127483321)
37. R. Fernándeza, B.F. d'Arlasa, P.A. Oyangurenb, and I. Mondragon Kinetic studies of the polymerization of an epoxy resin modified with rhodamine B Thermochim. Acta 493 2009 6 13
38. J. Málek The kinetic analysis of non-isothermal data Thermochim. Acta 200 1992 257 269
39. S. Monserrat, and J. Málek A kinetic analysis of the curing reaction of an epoxy resin Thermochim. Acta 228 1993 47 60
40. G.I. Senum, and R.T. Yang Rational approximations of the integral of the Arrhenius function J. Therm. Anal. Calorim. 11 1977 445 447
41. J. Wan, S. Wang, C. Li, D. Zhou, J. Chen, Z. Liu, L. Yu, H. Fan, and B.-G. Li Effect of molecular weight and molecular weight distribution on cure reaction of novolac with hexamethylenetetramine and properties of related composites Thermochim. Acta 530 2012 32 41
42. D. Zhou, D. Liu, H. Wang, Y. Lian, and Y. Luo Nonisothermal curing behaviors of novolac-type phenolic resins of varied ortho to para ratios Polym. Plast. Technol. Eng. 50 2011 983 989
43. D.-P. Zhou, S. Du, L. Yu, and Z. Liu Nonisothermal curing of a solid resole phenolic resin J. Appl. Polym. Sci. 121 2011 1938 1945
44. S. Vyazovkin, A.K. Burnham, J.M. Criado, L.A. Pérez-Maqueda, C. Popescu, and N. Sbirrazzuoli ICTAC Kinetics Committee recommendations for performing kinetic computations on thermal analysis data Thermochim. Acta 520 2011 1 19
45. S. Vyazovkin, and N. Sbirrazzuoli Isoconversional kinetic analysis of thermally stimulated processes in polymers Macromol. Rapid Commun. 27 2006 1515 1532 (Pubitemid 44535769)
46. S. Vyazovkin, and D. Dollimore Linear and nonlinear procedures in isoconversional computations of the activation energy of nonisothermal reactions in solids J. Chem. Inf. Comput. Sci. 36 1996 42 45 (Pubitemid 126579132)
47. S. Vyazovkin Model-free kinetics staying free of multiplying entities without necessity J. Therm. Anal. Calorim. 83 2006 45 51 (Pubitemid 43383210)
48. J.M. Kenny, G. Pisaniello, F. Farina, and S. Puzziello Calorimetric analysis of the polymerization reaction of a phenolic resin Thermochim. Acta 269-270 1995 201 211
49. L. Pilato Phenolic Resins: A Century of Progress 2010 Springer-Verlag Berlin Heidelberg
50. G. Rivero, V. Pettarin, A. Vázquez, and L.B. Manfredi Curing kinetics of a furan resin and its nanocomposites Thermochim. Acta 516 2011 79 87
51. S. Vyazovkin, and N. Sbirrazzuoli Isoconversional method to explore the mechanism and kinetics of multi-step epoxy cures Macromol. Rapid Commun. 20 1999 387 389 (Pubitemid 129715650)
52. S. Vyazovkin, and N. Sbirrazzuoli Kinetic analysis of isothermal cures performed below the limiting glass transition temperature Macromol. Rapid Commun. 21 2000 85 90
53. S. Vyazovkin, and C.A. Wight Model-free and model-fitting approaches to kinetic analysis of isothermal and nonisothermal data Thermochim. Acta 340-341 1999 53 68 (Pubitemid 129498249)
54. S.-W. Kuo, C.-L. Lin, and F.-C. Chang The study of hydrogen bonding and miscibility in poly(vinylpyridines) with phenolic resin Polymer 43 2002 3943 3949 (Pubitemid 34516856)
55. P.P. Chu, and H.D. Wu Solid state NMR studies of hydrogen bonding network formation of novolac type phenolic resin and poly(ethylene oxide) blend Polymer 41 2000 101 109 (Pubitemid 29507000)
56. S.-W. Kuo, C.-L. Lin, and F.-C. Chang Phase behavior and hydrogen bonding in ternary polymer blends of phenolic resin/poly(ethylene oxide)/poly((- caprolactone) Macromolecules 35 2002 278 285 (Pubitemid 34064330)
57. M.-W. Huang, S.-W. Kuo, H.-D. Wu, F.-C. Chang, and S.-Y. Fang Miscibility and hydrogen bonding in blends of poly(vinyl acetate) with phenolic resin Polymer 43 2002 2479 2487 (Pubitemid 34193785)
58. H.-D. Wu, C.-C.M. Ma, and P.P. Chu Hydrogen bonding in the novolac type phenolic resin blended with phenoxy resin Polymer 38 1997 5419 5429 (Pubitemid 127428155)
59. J. Wan, Z.-Y. Bu, C.-J. Xu, B.-G. Li, and H. Fan Learning about novel amine-adduct curing agents for epoxy resins: butyl-glycidylether-modified poly(propyleneimine) dendrimers Thermochim. Acta 519 2011 72 82
60. P. Simon Forty years of the Sesták-Berggren equation Thermochim. Acta 520 2011 156 157
61. J. Šesták, and G. Berggren Study of the kinetics of the mechanism of solid-state reactions at increasing temperatures Thermochim. Acta 3 1971 1 12
62. J. Wan, Z.-Y. Bu, C. Li, H. Fan, and B.-G. Li Preparation, melting, glass relaxation and nonisothermal crystallization kinetics of a novel dendritic nylon-11 Thermochim. Acta 524 2011 117 127
63. J. Wan, Z.-Y. Bu, C.-J. Xu, H. Fan, and B.-G. Li Model-fitting and model-free nonisothermal curing kinetics of epoxy resin with a low-volatile five-armed starlike aliphatic polyamine Thermochim. Acta 525 2011 31 39
64. J. Wan, Z.-Y. Bu, C.-J. Xu, B.-G. Li, and H. Fan Preparation, curing kinetics, and properties of a novel low-volatile starlike aliphatic-polyamine curing agent for epoxy resins Chem. Eng. J. 171 2011 357 367