Novel silicone aliphatic amine curing agent for epoxy resin: 1,3-Bis(2-aminoethylaminomethyl) tetramethyldisiloxane. 2. Isothermal cure, and dynamic mechanical property

Thermochimica Acta

Volumn 549, Issue , 2012, Pages 132-139

  Li, Cheng ^a   Fan, Hong ^a   Hu, Jijiang ^a   Li, Bogeng ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Epoxy resin; Extended Kamal model; Isothermal curing reaction; Silicone contained polyamine

Indexed keywords

ALIPHATIC AMINES; AUTOCATALYTIC; BISPHENOL A EPOXY RESIN; CURING REACTIONS; DIFFUSION CONTROL; DIFFUSION EFFECTS; DSC MEASUREMENTS; DYNAMIC MECHANICAL PROPERTY; KINETIC ANALYSIS; LOW TEMPERATURES; MODEL FITTING; MULTI FREQUENCY; POLYAMINES; REACTION PROCESS; TEMPERATURE INTERVALS;

ACTIVATION ENERGY; COMPUTER SIMULATION; EPOXY RESINS; ISOTHERMS; MECHANICAL PROPERTIES; REACTION RATES; RESINS; SILICONES;

CURING;

EID: 84867423496     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2012.09.008     Document Type: Article

References (48)

1. K. Mitra Assessing optimal growth of desired species in epoxy polymerization under uncertainty Chem. Eng. J. 162 2010 322 330
2. E.M. Petrie Epoxy Adhesive Formulations 2006 McGraw-Hill Publishing New York
3. M.J. Marks, and H.Q. Pham Encyclopedia of Polymer Science and Technology 2004 Wiley & Sons Inc.
4. T.-H. Liou Kinetics study of thermal decomposition of electronic packaging material Chem. Eng. J. 98 2004 39 51
5. L. Pilato Phenolic Resins: A Century of Progress 2010 Springer-Verlag Berlin Heidelberg
6. F.X. Perrin, T.M.H. Nguyen, and J.L. Vernet Chemico-diffusion kinetics and TTT cure diagrams of DGEBA-DGEBF/amine resins cured with phenol catalysts Eur. Polym. J. 43 2007 5107 5120
7. Y. Li, F. Xiao, and C.P. Wong Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy J. Polym. Sci. A: Polym. Chem. 45 2007 181 190
8. J. Wan, Z.-Y. Bu, C.-J. Xu, B.-G. Li, and H. Fan Preparation, curing kinetics, and properties of a novel low-volatile starlike aliphatic-polyamine curing agent for epoxy resins Chem. Eng. J. 71 2011 357 367
9. Y. Liu, S. Zheng, and K. Nie Epoxy nanocomposites with octa(propylglycidyl ether) polyhedral oligomeric silsesquioxane Polymer 46 2005 12016 12025
10. H.-T. Li, M.-S. Lin, H.-R. Chuang, and M.-W. Wang Siloxane- and imide-modified epoxy resin cured with siloxane-containing dianhydride J. Polym. Res. 12 2005 385 391
11. L.H. Lee, and W.C. Chen Organic-inorganic hybrid materials from a new octa(2,3-epoxypropyl)silsesquioxane with diamines Polymer 46 2005 2163 2174
12. P. Khurana, S. Aggarwal, A.K. Narula, and V. Choudhary Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines J. Appl. Polym. Sci. 87 2003 1345 1353
13. P. Khurana, S. Aggarwal, A.K. Narula, and V. Choudhary Studies on the curing kinetics of epoxy resin using silicon containing amide-amines J. Therm. Anal. Calorim. 71 2003 613 622
14. C. Li, C. Zuo, H. Fan, M. Yu, and B. Li Novel silicone aliphatic amine curing agent for epoxy resin: 1,3-bis(2-aminoethylaminomethyl) tetramethyldisiloxane. 1. Non-isothermal cure and thermal decomposition property Thermochim. Acta 545 2012 75 81
15. H.-T. Li, H.-R. Chuang, M.-W. Wang, and M.-S. Lin Synthesis, properties and pyrolysis of siloxane- and imide-modified epoxy resin cured with siloxane-containing dianhydride Polym. Int. 54 2005 1416 1421
16. C.Y. Hu, J.G. He, D.H. Obrien, and K.J. Irgolic N-(triorganylsilyl)alkyl ethylenediamines J. Organomet. Chem. 268 1984 31 38
17. J. Wan, S. Wang, C. Li, D. Zhou, J. Chen, Z. Liu, L. Yu, H. Fan, and B.-G. Li Effect of molecular weight and molecular weight distribution on cure reaction of novolac with hexamethylenetetramine and properties of related composites Thermochim. Acta 530 2012 32 41
18. J.M. Barton The application of differential scanning calorimetry (DSC) to the study of epoxy resin curing reactions Adv. Polym. Sci. 72 1985 111 154
19. G. Micco, M. Giamberini, E. Amendola, C. Carfagna, and G. Astarita Modeling of curing reaction kinetics in liquid-crystalline epoxy resins Ind. Eng. Chem. Res. 36 1997 2976 2983
20. R. Fernándeza, B. Fernándeza d'Arlas, P.A. Oyanguren, and I. Mondragon Kinetic studies of the polymerization of an epoxy resin modified with rhodamine B Thermochim. Acta 493 2009 6 13
21. R.A. Fava Differential scanning calorimetry of epoxy resins Polymer 9 1968 137 151
22. H.J. Borchardt, and F. Daniels The application of differential thermal analysis to the study of reaction kinetics J. Am. Chem. Soc. 79 1957 41 46
23. S. Sourour, and M.R. Kamal Differential scanning calorimetry of epoxy cure: isothermal cure kinetics Thermochim. Acta 14 1976 41 59
24. R.K. Musa Thermoset characterization for moldability analysis Polym. Eng. Sci. 14 1974 231 239
25. S. Vyazovkin, A.K. Burnham, J.M. Criado, L.A. Pérez-Maqueda, C. Popescu, and N. Sbirrazzuoli ICTAC Kinetics Committee recommendations for performing kinetic computations on thermal analysis data Thermochim. Acta 520 2011 1 19
26. S. Vyazovkin, and N. Sbirrazzuoli Isoconversional kinetic analysis of thermally stimulated processes in polymers Macromol. Rapid Commun. 27 2006 1515 1532
27. N. Sbirrazzuoli Is the Friedman method applicable to transformations with temperature dependent reaction heat? Macromol. Chem. Phys. 208 2007 1592 1597
28. C.C. Riccardi, and R.J.J. Williams A kinetic scheme for an amine-epoxy reaction with simultaneous etherification J. Appl. Polym. Sci. 32 1986 3445 3456
29. C.C. Riccardi, and R.J.J. Williams Statistical structural model for the build-up of epoxy-amine networks with simultaneous etherification Polymer 27 1986 913 920
30. M.R. Kamal, and S. Sourour Kinetics and thermal characterization of thermoset cure Polym. Eng. Sci. 13 1973 59 64
31. K.C. Cole, J.J. Hechler, and D. Noel A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone Macromolecules 24 1991 3098 3110
32. K.C. Cole A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 1. Mathematical development Macromolecules 24 1991 3093 3097
33. B. Jankovic The kinetic analysis of isothermal curing reaction of an unsaturated polyester resin: estimation of the density distribution function of the apparent activation energy Chem. Eng. J. 162 2010 331 340
34. S. Vyazovkin Advanced isoconversional method J. Therm. Anal. Calorim. 49 1997 1493 1499
35. S. Vyazovkin Computational aspects of kinetic analysis. Part C. The ICTAC kinetics project - the light at the end of the tunnel? Thermochim. Acta 355 2000 155 163
36. S. Vyazovkin Modification of the integral isoconversional method to account for variation in the activation energy J. Comput. Chem. 22 2001 178 183
37. S. Vyazovkin, and N. Sbirrazzuoli Isoconversional method to explore the mechanism and kinetics of multi-step epoxy cures Macromol. Rapid Commun. 20 1999 387 389
38. S. Vyazovkin, and N. Sbirrazzuoli Kinetic analysis of isothermal cures performed below the limiting glass transition temperature Macromol. Rapid Commun. 21 2000 85 90
39. S. Vyazovkin, and C.A. Wight Model-free and model-fitting approaches to kinetic analysis of isothermal and nonisothermal data Thermochim. Acta 340-341 1999 53 68
40. S. Vyazovkin, and N. Sbirrazzuoli Mechanism and kinetics of epoxy-amine cure studied by differential scanning calorimetry Macromolecules 29 1996 1867 1873
41. H.S. Chu, and J.C. Seferis Dynamic mechanical experiments for probing process-structure-property relations in amine-cured epoxies Polym. Compos. 5 1984 124 140
42. S. Cukierman, J.-L. Halary, and L. Monnerie Dynamic mechanical response of model epoxy networks in the glassy state Polym. Eng. Sci. 31 1991 1476 1482
43. F.G. Garcia, B.G. Soares, V.J.R.R. Pita, R. Sánchez, and J. Rieumont Mechanical properties of epoxy networks based on DGEBA and aliphatic amines J. Appl. Polym. Sci. 106 2007 2047 2055
44. L. Barral, J. Cano, A. López, P. Nogueira, and C. Ramírez Determination of the activation energies for α and β transitions of a system containing a diglycidyl ether of bisphenol A (DGEBA) and 1,3-bisaminomethylcyclohexane (1,3-BAC) J. Therm. Anal. Calorim. 41 1994 1463 1467
45. G. Li, P. Lee-Sullivan, and R. Thring Determination of activation energy for glass transition of an epoxy adhesive using dynamic mechanical analysis J. Therm. Anal. Calorim. 60 2000 377 390
46. W.K. Goertzen, and M.R. Kessler Dynamic mechanical analysis of carbon/epoxy composites for structural pipeline repair Compos. Part B: Eng. 38 2007 1 9
47. L. Núñez, F. Fraga, A. Castro, and L. Fraga Elastic moduli and activation energies for an epoxy/m-XDA system by DMA and DSC J. Therm. Anal. Calorim. 52 1998 1013 1022
48. H.W. Starkweather Simple and complex relaxations Macromolecules 14 1981 1277 1281